Semiconductor Manufacturing Equipment

In recent times, companies specializing in semiconductor manufacturing equipment have begun reshoring their production back to the United States. This trend involves relocating the manufacturing of products that were previously offshored. One such company is Stockwell Elastomerics, which utilizes cutting-edge materials to manufacture components tailored for this equipment, particularly in low to medium volumes. This is ideal for clients within the semiconductor manufacturing arena. The products they create include silicone, fluorosilicone, and polyurethane foams, which are precision cut into gaskets that serve the crucial functions of environmental sealing and cushioning. They also produce dielectric barriers to shield against electromagnetic interference (EMI) and protection against electrostatic discharge (ESD), employing elastomers and other materials suitable for the task. The necessity for small volume production in this sector stems from the demand for highly specific, one-off pieces for low volume machinery or in-process handling equipment found in manufacturing facilities.

Silicone vs. Silicon

Equipment used in semiconductor manufacturing is critical for the production of semiconductor chips, which are integrated circuits (ICs) that are constructed on semiconductor wafers. These wafers are thin, flat disks made of semiconductor materials that serve as substrates. The most common material for these wafers is silicon, which is the second most abundant element in the Earth's crust. While silicon metal is a component of silicone rubber, it is essential to distinguish that silicon and silicone, despite their similar names, are different entities.

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Types of Semiconductor Manufacturing Equipment

To maintain optimal production processes, the semiconductor industry relies heavily on cleanrooms, as silicon wafers and other types are exceptionally sensitive to environmental pollutants. Within these controlled environments, various machinery is employed, including dicing machines, probing machines, polish and edge grinders, chemical mechanical planarization (CMP) equipment, and equipment for slicing wafer demounting and cleaning. Stockwell Elastomerics supports manufacturers of semiconductor equipment looking to relocate operations by supplying die-cut, waterjet-cut, and molded parts. With a substantial inventory available, they are equipped to make material recommendations across a broad spectrum and expedite the manufacturing of necessary components.

Environmental Seals and Cushions

Stockwell Elastomerics produces polyurethane gaskets that effectively provide environmental sealing, protecting against dust and moisture. These gaskets can be utilized in various applications, including sputtering chambers, vacuum pumps, crystal growth chambers, and dosing equipment. The PORON® microcellular urethane foams are particularly effective for creating dust and splash seals. These materials, sourced from Rogers Corporation, are available in multiple thicknesses and compressibility levels, varying from extra soft to very firm.

These cellular materials excel in their ability to resist compression set, making them ideal for use in semiconductor equipment enclosures where proper sealing under considerable pressure is required for doors or hatches. Nevertheless, during the semiconductor production process, it is common to encounter various organic solvents, acids, and metals. In scenarios where contact with these harsh chemicals is expected, seals made from fluorosilicone would be the preferred choice.

Another option for sealing and cushioning are silicone foam gaskets, which can fulfill some of the demands of certain applications. Rogers BISCO® silicone foams and Saint-Gobain NORSEAL® foams are available in numerous firmness levels, with most attaining a UL 94V-0 flame rating. Low-density silicone foams may allow moisture penetration through their structure; however, selecting higher density silicone foams can lead to a watertight compression seal. The viscoelastic characteristics of these silicone foams significantly mitigate the adverse effects of machine vibrations, enhancing operational efficiency.

Dielectric Barriers, EMI Gaskets, and ESD Protection

As with other electronic machinery, electrical insulation is vital for semiconductor manufacturing equipment, particularly when high-power electronics are involved. Dielectric barriers, crafted from solid and foam silicone materials, serve to impede electrical currents. When semiconductor wafers engage with handling devices, triboelectric charging can generate a risk of electrostatic discharge (ESD) events. To counteract this, components made from electrically conductive elastomers enable the dissipation of such charges.

Additionally, cross-talk from circuitry in adjacent equipment can result in electromagnetic interference. Stockwell Elastomerics provides EMI gaskets fabricated from conductive silicone materials to prevent this interference, while molded fluorosilicone O-rings offer enhanced chemical resistance for use in photolithography and CMP equipment.